PROJECT // 03
Mr.Robot
A design for an artifact to test the precision of an additive manufacturing process
Role
Packaging study
Timeline
Signal
Thermal risk reduced
Constrained electronics packaging
A packaging study for electronics cooling, gasket compression, assembly sequencing, and maintenance access inside a constrained volume. The dossier maps thermal concerns to enclosure geometry and service procedures.
Outcome
Risk areas were reduced through clearer airflow paths, gasket intent, and access planning before the design moved into deeper validation.